It won’t be a regular day for us without at least one iPhone 5S leak. This time it’s the phone’s unusually-neat innards that have been bared in front of the camera.
French website NowhereElse has published pictures of what is allegedly the motherboard of the new iPhone. The report goes on to point that Apple has made changes in the camera component in comparison to the old mobo. There is even a detailed comparison between the two motherboards. When placed side by side with the one used on the iPhone 5, the new motherboard certainly reveals a different look and Apple could in fact be working on a camera module that can compete with the likes of the Nokia Lumia 920 and HTC One, not to mention other standouts like the Galaxy S4 and Xperia Z.
The side-by-side comparison of the old and the allegedly new camera modules
The picture of the new camera component comes all the way from Japan and was sent to the website by retailer Moumantai. Although the part bears an uncanny resemblance to the iPhone 5′s motherboard, there are very noticeable differences. The same component inside last year’s iPhone is connected to two separate ribbons, while the updated design uses only one ribbon for all the necessary connections.
The French report also speculates on whether the new design is in fact a cost-cutting measure for the budget iPhone that is rumoured to be in the works in Cupertino. However, with just a peek at the motherboard to go on, there’s no way of determining exactly which iPhone, if at all, will come with the redesigned camera module.
Publish date: May 10, 2013 12:52 pm| Modified date: December 19, 2013 11:26 am
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