Earlier this month, it was reported that HTC had a new handset in the works, which is scheduled for a debut at the Mobile World Congress (MWC), next year. The upcoming handset is reportedly known as the HTC Ville and it will be the thinnest smartphone from HTC measuring at 8mm thin uniformly, unlike the Motorola RAZR, which features the bump. According to a report by Phandroid, the upcoming Droid will feature a metal unibody design and could be one of the first smartphones to feature Qualcomm’s Snapdragon S4 platform.

Stylish metallic unibody design (Image credit: PocketNow)

Stylish metallic unibody design (Image credit: PocketNow)

Here is a quick look at the specifications of the HTC Ville:

  • Android Ice Cream Sandwich with HTC Sense UI 4.0
  • 4.3-inch qHD Super AMOLED display
  • 1.5GHz dual-core Qualcomm Snapdragon Series 4 processor
  • 8MP rear camera with a back-illuminated sensor that supports 1080p video capture
  • Beats audio
  • HSPA+
  • 1650mAh battery

The handset will not feature NFC capabilities. If announced at MWC in February, the handset could possibly hit shelves by April. It appears that all manufacturers are jumping onto the thin bandwagon and judging by the looks of this handset, it seems that this is 'the' handset to look out for.

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