With CeBIT 2012 on in full swing, we have all the top component manufacturers showcase their latest and greatest creation that are yet to hit store shelves. We saw Gigabyte, earlier today and now it's MSI's turn. The company showcased their motherboards, which use the new Military Class III components for the Z77, H77 and B75 chipsets from Intel. These are the new boards designed for Intel's 22nm Ivy Bridge CPUs and will be based on the same LGA1155 socket.
Back with a bang
Their line-up includes the Z77A-GD80, Z77A-GD65, Z77A-GD55, Z77A-G45 and Z77MA-G45 which are based on the high-end Z77 chipset; the ZH77-G43 based on the mid-end H77 chipset and the B75A-G43 based on the entry-level B75 chipset. With the adaptation of Military Class III components on MSI 7-series chipset motherboards, enthusiasts get the highest quality and stability. These components have passed seven rigorous tests that have been conducted by third party laboratories. The tests include extreme temperature, humidity, pressure, vibration and dropping, which have earned them the MIL-STD-810G Military Class Certification. In addition to this, the motherboards are equipped with several of MSI’s exclusive technologies, like OC Genie II, ClickBIOS II, MultiBIOS II, etc. MSI also displayed the Big Bang-XPower II and X79 series motherboards that have recently beaten the highest core clock speed and FSB frequency records.
In addition to importing Highly-conductive Polymerized Capacitors (Hi-c CAP), Super Ferrite Choke (SFC) and Solid Capacitors (Solid CAP), there is also the next generation DrMOS – DrMOS II. It is embedded with fully automatic dual-thermal protection; when the operating temperature reaches to about 115 degrees, an indicator on the motherboard will light up, warning the enthusiast to check MOSFET’s cooling status; if the operating temperature reaches to about 130 degrees, the system will automatically power off, ensuring the motherboard will not be damaged from high temperature. Expect to see these boards in the market soon.
Publish date: March 9, 2012 5:39 pm| Modified date: December 18, 2013 9:47 pm
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